3D AOI Products

3D measurement + auto inspection with side cameras + 2D inspection = Saki's BF-3Di series

Saki's new 3rd generation AOI systems don't just inspect, they measure the height of all parts on the PCB and provide clear side-view images of the ICs and all devices on the board, significantly improving inspection capabilities over 2D technology. Saki's unique Phase Measurement Profilometry technology provides the 3rd dimension of the Z axis. Using quad-directional side cameras, the BF-3Di Series inspects QFNs, J-leads, and connectors, and enables the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed.

The BF-3Di system incorporates the leading technology and functionality of Saki's 2D systems, such as its patented coaxial top-light illumination and extra component detection (ECD), to achieve seamless 3D imaging and reliable inspection, regardless of board and component colors. 2D technologies provide accurate and reliable polarity detection, character recognition (OCR/OCV), bridge detection, and alignment inspection, which are difficult to inspect with 3D imaging technology. Combining the strength of Saki's unique technologies maximizes automatic inspection coverage, utilization, and return-on-investment.

Saki's 3D AOI systems:

  • Measure heights from 0 to 20mm
  • Measure the surface of the surface mount device (SMD) and pin through-hole (PTH) package from all four directions without a dead angle
  • Achieve full automation with very low false calls and zero escapes
  • Detects failures of microchips with small pads and parts that have bottom electrodes. Directly reads sample and component height data to analyze assembly conditions

Saki's BF-3Di Series includes:

BF-3Di-L1 for L size boards

BF-3Di-Z1 for XL size boards

BF-3Di-D1 with dual lanes

Flexibility for increased throughput

The BF-3Di Series' large platform lets you cut production time almost in half. It can handle extra-large boards of 686x870mm in single lane mode or 2 lanes of 320 x 510mm boards in dual lane mode. Whichever you choose, Saki's scanning technology and seamless field-of-view (FOV) imaging inspect and measure in one pass, collecting data and images and providing feedback that can be used to make course corrections in real time. The flexibility of Saki's BF-3Di Series enables you to customize the system that's best for your manufacturing process.

Seamless FOV imaging technology

The BF-3Di Series inspects the entire PCB and provides seamless merging of the acquired images into a single image, even for multiple fields of view of very large components. This unique technology is derived from enhancements on Saki's powerful 2D line scan technology.

Unique optical system

The BF-3Di series accurately measures components by projecting stripe patterns (slices) from the same focal point. Whenever a stripe reflects off a component, its height is accurately measured to precisely determine the height of the features.

Hardware and software that provide absolute measurement

A quad-phase projector system, dynamic range extension, and highly rigid frame reduce noise from reflected light. Combined with automatic board surface detection, high-speed height calculation, and reduced blind spots the system delivers absolute 3D measurement with high image quality.

Simple, easy, time-saving operation, programming, debugging, and course corrections

Saki's Auto Programming Software significantly reduces library creation time. Optimal inspection libraries are automatically assigned and created by utilizing Gerber and CAD data. The BF-3Di series uses pad shape information to provide automatic inspection based on IPC standards. Reliable threshold settings are determined from statistical information and model images are provided in the offline debug feature, which is installed as standard on every machine. The board is not needed for programming. Saki's proprietary, easy-to-use and program software enables programming and debugging off line. This greatly improves the reliability of inspection performance and results, regardless of user skill level. In addition, program corrections can be made in real time without stopping the inspection process.