3D CT X-ray Technology Enables Full Inspection of Inline Volume Production
Smart Factories will require open innovation for automated SMT lines that consists of equipment from several vendors that operate using M2M communication. A more global production system has to be developed to manufacture high quality products, with shorter lead-times and low cost, to address the increased diversity in electrical product specifications.
Accuracy in 3D AOI Enables M2M Communications
Inspection systems are playing a significant role in communicating with equipment for Industry 4.0 and M2M communications. Studies done with Panasonic placement systems and Saki inspection systems show that one of the most important criteria for M2M communication is accuracy.
Saki: True 3D Makes the Difference
3D automated X-ray inspection has become a necessity, especially in the automotive, medical, and aerospace industries. When boards are exposed to high heat, voids can result in explosions and electrical failures. Head-in-pillow and non-wetting solder joints are especially difficult to detect. The problem with X-ray inspection has been that manufacturers have had to design their inspection systems to remove the images from the underside of the board, so instead of being a true 3D system, they are actually more like 2.5D. Their systems take a maximum of 5 slices through the board, often missing a defect.
Saki Celebrates Over Two Decades of Technology and Expansions
In 1995, the company launched its proprietary high-speed inspection technology and its journey began. Today, Saki not only offers 2D AOI, but a complete line of 3D automated X-ray inspection (AXI), solder paste inspection (SPI), and AOI technologies. Now in its 22nd year, the company has grown into a worldwide organization with over 15,000 units in the field, and continues to develop.